Chiplet Summit Announces 2026 Best of Show Award Winners

Siemens EDA, UCIe Consortium, and Sarcina Technology Win the First Annual Chiplet Industry Awards Celebrating Technical Innovation and Excellence

SANTA CLARA, Calif.–(BUSINESS WIRE)–#AdvancedPackaging–The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, today reported on its 2026 Best of Show Awards at the Santa Clara Convention Center.

The winners are:

• Siemens EDA for “Packaging: Design” – Their Innovator3D IC software enables fast planning and heterogeneous integration of ASICs and chiplets using 2.5D and 3D packaging technologies.
• UCIe Consortium for “Connectivity and Interoperability” – Their UCIe 3.0 specification delivers higher performance to meet demand for high-speed, interoperable chiplet solutions.
• Sarcina Technology for “Packaging: Hardware” – Their advanced chiplet-based AI package design enables scalable, high-bandwidth systems, delivered through turnkey packaging and test services without the need for an in-house packaging team.

“Chiplet innovation is everywhere,” said Chuck Sobey, General Chair, Chiplet Summit. “We received a wide range of compelling submissions that highlighted advances in design, interoperability, and packaging. We congratulate our winners on their leadership and technical excellence.”

For details on the winners, go to https://chipletsummit.com/2026-best-of-show-awards/

About Chiplet Summit

Chiplet Summit, a product of Semper Technologies, is the industry’s largest chiplet show. It serves the needs of technologists who use chiplets in designs for processors, memories, communications chips, and AI devices. For more information, visit www.chipletsummit.com.

Contacts

Media Contact:
Dan Chmielewski
Madison Alexander PR
[e-mail]
949-231-2965
@MadAlexPR
@TecFlack