New TOLT (TO-Leaded, Top-Side Cooled) package, built on Wolfspeed’s Gen 4 MOSFET technology, enables higher power density and thermal performance for next-generationNew TOLT (TO-Leaded, Top-Side Cooled) package, built on Wolfspeed’s Gen 4 MOSFET technology, enables higher power density and thermal performance for next-generation

CORRECTING and REPLACING PHOTO Wolfspeed Unveils Next-Gen TOLT Portfolio to Address Surging AI Datacenter Demand

4 min read
  • New TOLT (TO-Leaded, Top-Side Cooled) package, built on Wolfspeed’s Gen 4 MOSFET technology, enables higher power density and thermal performance for next-generation AI datacenters.
  • Purpose-designed to meet the rapidly increasing power and cooling demands for AI and hyperscale datacenters, TOLT unlocks more efficient, scalable, and compact system architectures.
  • TOLT joins the previously released U2 portfolio as the second of three Wolfspeed top-side cooled package families, aimed at one of the fastest-growing industry segments.
  • Backed by Wolfspeed’s U.S.-based silicon carbide wafer manufacturing the TOLT solution provides customers with supply chain resilience and performance consistency at scale.

DURHAM, N.C.–(BUSINESS WIRE)–Please replace the photo with the accompanying corrected photo.

The release reads:

WOLFSPEED UNVEILS NEXT-GEN TOLT PORTFOLIO TO ADDRESS SURGING AI DATACENTER DEMAND

  • New TOLT (TO-Leaded, Top-Side Cooled) package, built on Wolfspeed’s Gen 4 MOSFET technology, enables higher power density and thermal performance for next-generation AI datacenters.
  • Purpose-designed to meet the rapidly increasing power and cooling demands for AI and hyperscale datacenters, TOLT unlocks more efficient, scalable, and compact system architectures.
  • TOLT joins the previously released U2 portfolio as the second of three Wolfspeed top-side cooled package families, aimed at one of the fastest-growing industry segments.
  • Backed by Wolfspeed’s U.S.-based silicon carbide wafer manufacturing the TOLT solution provides customers with supply chain resilience and performance consistency at scale.

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today introduced its new TOLT package portfolio, which enables maximum power density in a power supply for datacenter rack applications. The TOLT package is engineered to release heat from the top side of the package, making cooling far more efficient. This enables companies to build smaller, more reliable power systems that support the rising demands of AI datacenters.

“AI is pushing datacenter OEMs to be incredibly strategic about the size and total efficiency of their power systems,” said Guy Moxey, vice president of Wolfspeed’s Industrial & Energy business. “Our TOLT product family offers a straightforward path to delivering higher-density, thermally optimized power systems capable of sustaining the demands of AI datacenters, and Wolfspeed’s Gen 4 technology helps these systems run cooler, more efficiently, and more reliably.”

Silicon carbide technology is one of the fastest-growing components of both the power device market and the greater semiconductor industry. A superior alternative to silicon, silicon carbide is ideal for high power applications – such as AI datacenters, e-mobility, renewable energy systems, and battery energy storage systems – that unlock improved performance and lower system costs.

As global markets prioritize supply chain resiliency, it is crucial that the U.S. continues to make strategic investments to cement its technological dominance, while continuing to spur American innovation in critical technologies. Wolfspeed’s U.S.-based silicon carbide substrate production supports rapidly scaling AI projects by providing a stable, domestic supply for mission-critical power systems.

Wolfspeed’s 650 V TOLT products are available in a variety of RDSON options at Wolfspeed.com. More details on the third top-side cooled portfolio from Wolfspeed will be shared in the second-half of 2026.

About Wolfspeed, Inc.

Wolfspeed (NYSE: WOLF) leads the market in the worldwide adoption of silicon carbide technologies that power the world’s most disruptive innovations. As the pioneers of silicon carbide, and creators of the most advanced semiconductor technology on earth, we are committed to powering a better world for everyone. Through silicon carbide material, Power Modules, Discrete Power Devices, and Power Die Products targeted for various applications, we will bring you The Power to Make It Real.™ Learn more at www.wolfspeed.com.

Wolfspeed® is a registered trademark and The Power to Make it Real™ are registered trademarks of Wolfspeed, Inc.

Forward-Looking Statements

This press release contains forward-looking statements involving risks and uncertainties, both known and unknown, that may cause Wolfspeed’s actual results to differ materially from those indicated in the forward-looking statements. Forward-looking statements by their nature address matters that are, to different degrees, uncertain, such as statements about Wolfspeed’s strategic plans, priorities, growth opportunities, and ability to achieve profitability. Actual results could differ materially due to factors detailed in Wolfspeed’s filings with the U.S. Securities and Exchange Commission (“SEC”), including its most recent Annual Report on Form 10-K and subsequent SEC filings. These forward-looking statements represent Wolfspeed’s judgment as of the date of this release. Except as required under U.S. federal securities laws, Wolfspeed disclaims any intent or obligation to update any forward-looking statements after the date of this release.

Contacts

Media Relations: media@wolfspeed.com
Investor Relations: investorrelations@wolfspeed.com

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