Chiplet Summit Announces Pre-Conference Day Schedule

Tutorials that bring chiplet practitioners at all experience levels up to speed

SANTA CLARA, Calif.–(BUSINESS WIRE)–#AdvancedPackaging—Chiplet Summit, the biggest chiplet show ever, announces its pre-conference day schedule. It will occur on Tuesday, February 17, at the Santa Clara Convention Center, ahead of the main event taking place February 17-19, at the Santa Clara Convention Center.

The pre-conference day helps attendees get current quickly in multiple technologies. It meets the needs of both newcomers seeking a strong general base and veteran chip designers looking for deeper expertise. It also covers emerging topics such as the latest packaging methods, 1000-chiplet systems, the open chiplet economy, and chiplet fusion.

Morning tutorials (8:30 am-noon) focus on basics, interfacing, and packaging:

• Chiplet Basics
• HBM Interfacing
• Advanced Packaging Methods
• Introduction to Die-to-Die Interfaces (sponsored by Alphawave Semi)
• Deterministic Ethernet (sponsored by Daedaelus)

Afternoon sessions (2:10-6:00 pm) dive into real-world challenges and new topics:

• Meeting the 1,000-Chiplet Challenge
• Working with Foundries
• Applying Die-to-Die Interfaces (sponsored by the UCIe Consortium)
• Open Chiplet Economy (sponsored by Open Compute Project)
• Chiplet Fusion (sponsored by Daedaelus)

The pre-conference day also features a Superpanel on “The Best Way to Make Chiplets Work Together in Applications.” It closes with the popular beer-pizza expert table session, which offers one-on-one access to industry experts on key subjects.

Summit General Chair Chuck Sobey says, “Our pre-conference day helps attendees who specialize in design, packaging, test, or integration catch up quickly on advances outside their core areas. Meanwhile, newcomers can build a strong base in the entire chiplet design process.”

For more information, including registration details and the full conference agenda, visit www.chipletsummit.com.

To discuss exhibiting, contact:

David Blaza, Exhibit Sales Director

[e-mail] |

+1.512.736.3171

About Chiplet Summit

Chiplet Summit, a product of Semper Technologies, is the industry’s largest chiplet show. It serves the needs of technologists who use chiplets in designs for processors, memories, communications chips, and AI devices. For more information, visit www.chipletsummit.com.

Contacts

Media Contact

Dan Chmielewski

Madison Alexander PR

714-832-8716

C: 949-231-2965

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